I have been burned by “popcorning” both in my repair work and also in small production runs too many times and now I almost always desiccate populated boards and parts at 80-100 Celsius for 24-48 hours before hot air rework or reflow soldering. Does anyone else do this? In my experience, the risk from “popcorning” and moisture sensitivity failure in general is 10x worse than ESD sensitivity.
