I am trying to restore + mod an SE/30. I have done some work to the logic board and will have some questions about that to post in this thread after I do some due diligence. My first question relates to the analog board. I started by resoldering the connectors and any suspicious looking joints. While doing this I lifted a pad on the TDA1170N (connects to a capacitor, don't remember right now which one.) I put the pad back and resoldered, trying to blob it back to the trace (important later.)
On testing I was greeted with a centered horizontal line. A troubleshooting guide lead me to think the TDA1170N had failed. The original is an SGS, the new one is a Telefunken (the ebay listing was for SGS, don't ask me.) After replacing the chip and doing continuity checks, I realized the problem was likely that I hadn't made good contact from the lifted pad. I exposed more trace and bodged to get good connection.
At this time I also recapped the analog board for good measure. In doing this, I replaced C12 (it had a bulge and leaked when touched even though it was a film cap?) The part I used for this capacitor is a PP cap (R76PI233050H3J .) It should be fine with temperature range, capacitance, and lead spacing is perfect. If I understand PP caps correctly, it should have lower esr and might cause issues later at high temperatures, but shouldn't be an issue at the short term open case testing phase at least.
I am now getting horizontal lines that flicker?, jitter?, I don't know the right word, please see the video.
Because it is so easy to lift pads on this board, and the heat sensitivity the datasheets for TDA1170N talk about, I am hesitant to put the old chip back. I would like to know if this is just an adjustment issue (I have tools for that on the way,) or if there is anything else I should be looking at before I proceed like a bull in a china shop. Before I started the picture was good to begin with and my original intention was to address the solder joints of the connectors and recap the board for maintenance.
On testing I was greeted with a centered horizontal line. A troubleshooting guide lead me to think the TDA1170N had failed. The original is an SGS, the new one is a Telefunken (the ebay listing was for SGS, don't ask me.) After replacing the chip and doing continuity checks, I realized the problem was likely that I hadn't made good contact from the lifted pad. I exposed more trace and bodged to get good connection.
At this time I also recapped the analog board for good measure. In doing this, I replaced C12 (it had a bulge and leaked when touched even though it was a film cap?) The part I used for this capacitor is a PP cap (R76PI233050H3J .) It should be fine with temperature range, capacitance, and lead spacing is perfect. If I understand PP caps correctly, it should have lower esr and might cause issues later at high temperatures, but shouldn't be an issue at the short term open case testing phase at least.
I am now getting horizontal lines that flicker?, jitter?, I don't know the right word, please see the video.
Because it is so easy to lift pads on this board, and the heat sensitivity the datasheets for TDA1170N talk about, I am hesitant to put the old chip back. I would like to know if this is just an adjustment issue (I have tools for that on the way,) or if there is anything else I should be looking at before I proceed like a bull in a china shop. Before I started the picture was good to begin with and my original intention was to address the solder joints of the connectors and recap the board for maintenance.