Have been getting a RaSCSI updated to PiSCSI which never did workout using a headless Pi Zero installation; not a realistic process, however did get it working by putting a Pi 3B in the mix.
After removing the PiSCSI (w Pi Zero W) from the case I noted it was really hot almost to the point of not being able to handle it and was worried it was ruined. I have been using it outside of the case and it has been working, but low level hot to the touch. On searching, the SN74LS641-1 chips do run hot although to the touch this one seems excessive. It is working so I was going to put heat sinks on the chips however, with the Pi Zero configuration, on top (to fit in PotatoFi slim 3d printed case) the area is cramped. Based on the pictures, am I likely to improve the situation by adding the heat sinks or just make it worse?
After removing the PiSCSI (w Pi Zero W) from the case I noted it was really hot almost to the point of not being able to handle it and was worried it was ruined. I have been using it outside of the case and it has been working, but low level hot to the touch. On searching, the SN74LS641-1 chips do run hot although to the touch this one seems excessive. It is working so I was going to put heat sinks on the chips however, with the Pi Zero configuration, on top (to fit in PotatoFi slim 3d printed case) the area is cramped. Based on the pictures, am I likely to improve the situation by adding the heat sinks or just make it worse?