I can confirm ordering the same parts as rikerjoe above for my SE/30 from Mouser, and in addition, I ordered
Texas Instruments / SN74F253DR
I tried to find a picture of the board post-fix, but I don’t think I took one. I replaced the whole column of chips, possibly overkill, but it allowed me to make sure it was absolutely clean underneath. UE8 made the difference for mine I think, as I was getting similar vertical ”chain” patterns. Once I had a more “conventional” simasimac pattern I realized I had to reseat the ROM. In all of my troubleshooting, taking RAM in and out, removing the ROM SIMM, I just wasn’t getting good contact.
I will add that the above steps came after a hard-fought battle armed with a multi-meter and schematics. I had already continuity-checked every single trace between those chips and other destinations (ROM, CPU, GLU VIA etc. etc. etc.). Once you get the hang of it, you can move through them pretty easily, but it takes some heads-down time to buzz the traces.
Finally, I will share that I used ChipQuik de-soldering alloy to easily remove these chips. This was very handy for me. I have a good iron, but not hot air, heated plate or anything like that. ChipQuik melts at a lower temp and stays molten so you can grab the component. Basically, you lay down a bunch of flux and run a bead of the stuff across the pins at the same time. You then need to do some cleanup, but you can also re-use the alloy blobs on the next component. It will eventually gather the actual solder and become less effective, but for me, I was able to use mostly the same blobs of the stuff for the whole job and again for something else—a little goes a long way.